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SABIC modified materials help Chico achieve fine spacing 3D-MID miniaturization

Industry News > SABIC modified materials help Chico achieve fine spacing 3D-MID miniaturization

Cicor, a leading manufacturer of printed circuit boards and hybrid circuits, produces high-end 3D molded interconnect devices (3D-Mid) using SABIC LNP™ THERMOCOMP™ modified materials with LDS (Laser Direct Molding) characteristics.

Chico and SABIC have been working together for a long time to develop sophisticated components that meet stringent requirements for applications in 5G networks, automotive and consumer electronics.

SABIC's LNP THERMOCOMP products provide excellent fluidity and optimized LDS performance for thin-wall structures in micro designs, helping to achieve uniform fine-pitch circuit patterns and excellent high temperature resistance in SMT assembly processes.

"SABIC is a leading producer of laser directly molded functional materials.

In the manufacturing process of highly integrated electronics, laser direct molding helps to save space in small and thin electronic devices, "said Zhao Fan Li, director of product business management for LNP and NORYL, SABIC's specialty products division.

"With the rapid development of 3D-MID technology, Chico wants to innovate its product design to achieve superior performance and higher precision, and SABIC is able to meet the needs of the company.

With material innovation and expertise, we are committed to helping customers like Chico stay ahead of trends in electronics."

"We have been continuously studying the specific application of liquid crystal polymers in fine-pitch 3D-MID products.

During this process, we quickly found that SABIC LNP THERMOCOMP based on LIQUID crystal polymers showed superior performance in terms of homogeneity and circuit trace accuracy, which was the best solution to meet our requirements, "said HS Song, General Manager of Suzhou Chi Co Electronics Technology Co., LTD.

"In addition, this material also helps us to increase the production rate, thus reducing the overall system cost.

To help us use LNP THERMOCOMP, SABIC also provides a number of value-added services including formula adjustments.

"SABIC's material knowledge and unmatched technical expertise, coupled with its ability to respond quickly to customer needs, is an example of a supplier that performs well."

Innovative MID material technology

Because molded interconnects can combine electrical and mechanical functions into a single 3D component, this structure helps save space and weight compared to traditional printed circuit boards.

As 5G infrastructure construction advances and 5G application scenarios are implemented, such high-precision micro-devices can help miniaturize systems and meet stringent requirements for high performance.

5G coverage in cities, for example, will require a large number of cell towers to be built in close proximity to allow faster data transmission while remaining invisible.

SABIC LNP THERMOCOMP with LDS characteristics has played an important role in the design and production of high-end MID.

This feature helps manufacturers create narrow spacing between traces and highly complex patterns.

200 micron) fine spacing device.

The SABIC materials used to cast such devices contain laser activation additives.

This additive helps to create conductive traces on the surface of the device and is metallized using electroless technology.

This class can achieve accurate and uniform metallization of key circuit traces.

In addition, they provide low and stable dielectric constant (Dk) and loss (Df) performance.

LNP THERMOCOMP THERMOCOMP can be used for casting thin-wall parts with thickness less than 0.5 mm thanks to its excellent fluidity (10-100 times higher than other polymers) and dimensional stability.

The material's high mobility also helps speed up output.

Previously, Chiko has used high-performance semi-crystalline materials to produce MID products.

However, as MID specifications continue to rise, SABIC's LNP THERMOCOMP is the ideal choice for The company due to its unique properties.

Compared to similar products currently on the market, SABIC's LNP THERMOCOMP has improved dimensional stability, helping to reduce warpage and improve design accuracy.

Another advantage is that it also provides superior high temperature resistance during surface mount compared to other polymers.

"This solution from SABIC meets Troco's demand for high-performance specialty materials that meet stringent standards in automotive, telecommunications and consumer electronics components," said Qin Wang, Director of Formulation and application development, SABIC Specialty Products Asia Pacific.

"These applications require smaller, thinner specifications with multiple functions and high temperature resistance in high temperature operating environments.

Our LNP products help address these challenges and demonstrate the strength of 70 years of continuous material innovation.

"LNP THERMOCOMP's innovative materials and customers' trust in SABIC is a testament to this."

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SABIC modified materials help Chico achieve fine spacing 3D-MID miniaturization

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